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This specification covers an electrically-conductive adhesive supplied as two components, a paste of silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.

This adhesive has been used typically for providing an electrically-conductive bond between surfaces and as an electrically-conductive sealing compound, but usage is not limited to such applications.

Product Details

Published:

05/31/2005

File Size:

1 file , 94 KB